1.Product description

CHMC's DIP29 intelligent power module(IPM) has the characteristics of high integration and high reliability,It is widely used in low and medium power variable frequency drives, such as servers, frequency converters, air conditioners,etc.

DIP29 packaging structure adopts DBC ceramic substrate, which has the characteristics of high insulation and high thermal conductivity.Drive IC adopts PCB as the carrier substrate, which has flexible design.The internal circuit is led out through the lead frame, which is especially suitable for applications requiring compact installation.

2.Product structure

3.Product appearance

4.Package outline dimension

5. Internal Circuit