Front-end K-level-cleanroom Workshop
Back-end 10K-level-cleanroom Workshop
Reliability Test Center
Introduction to OEM Process and Manufacturing
Key Process Equipment
Key processes introduce international advanced equipments to ensure product quality.
ASM Die Bond
Machine, with XY position accuracy ± 1.0mil and T-axis rotation tolerance 0.4 °, can mount 60um ultra-thin chips with good consistency and stability of product quality.
German SMT Vacuum Reflow
Furnace, with maximum welding temperature of 350 ℃, welding void rate of less than 1%, and high production efficiency, accurate temperature control and good stability.
K&s Aluminum Wire
Bonding Machine, with transmission accuracy of ± 35um, total welding accuracy of ± 25um, ALC stripping function, good product consistency, no chip damage and high stability.
ASM Gold Wire
Bonding Machine, with welding accuracy of 3um, welding temperature of up to 300 ℃, and stable welding wire push-pull data.
Chiphow Microelectronics(Huizhou) Co, Ltd.
Company address：Block 18, Block 17, No.252 Zhongkai Road, Zhongkai High-Tech
Telephone：86-752-2609331
Telephone：86-752-2609360
E-mail：marketing@chmicro.com
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